The RW-V111B (Direct-Drive) is a compact dual-arm wafer handling robot designed for high-precision semiconductor applications. With a 0.5 kg payload, Class 1 @ 0.1 μm cleanliness, and DC 48 V / DC 24 V power supply, it delivers clean, reliable wafer handling with flexible top-mounting integration.
| Arm type | Dual-Arm | ||
| Travel | Z axis | 40mm | |
| T axis | 0~360deg | ||
| R/W axis | 351mm(customizable) | ||
| Maximum speed | Z axis | 250mm/s | |
| T axis | 360deg/s | ||
| R/W axis | 1000mm/s | ||
| Repetitive positioning accuracy | Z axis | ±0.05mm | |
| T axis | ±0.006deg | ||
| R/W axis | ±0.05mm | ||
| Payload | 0.5Kg(including end-effector) | ||
| Number of control axes (servo) | 3 | ||
| Cleanliness class | [email protected]μm | ||
| Mounting type | Top mounting | ||
| Total weight | 50kg | ||
| Vacuum level | <1×10-⁶Pa | ||
| Body leakage rate | <1×10-⁹std.cc/sec He | ||
| Cable length (robot-controller) | 3m(standard) | ||
| I/0 interface | 5IN;80UT | ||
| Power supply | DC48V 25A,DC24V 5A | ||
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